SiC / GaN Related Technology & China Market On-Line Seminar

弊社とAlltech社(中国)が2022年4月にてSiC/GaN関連技術のオンラインセミナーを行う予定です。

詳細内容はこちら

• Advanced technology of SiC/GaN wafer slicing, grinding, lapping, polishing
• New dicing technologies (stealth laser & ultra-sonic blade dicing) for SiC power device
• Solution share of SiC power device wafer test, chip test
• A new technical trend – SiC bonded wafer & Hybrid bonding technology for high-level SiC power device
• High heat resistance Temporary Bonding / Debonding materials
• Ga2O3 substrates & epitaxial wafers
• New trend of SiC power device packaging – Ag soldering -> Cu soldering